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WANG Min, ZHANG Yuqing, YANG Xiaoshuai, ZHANG Pu, CHEN Yang, XIE Guangqiang. Simulation Analysis and Optimization of Injection Molding of Mobile Phone Back Cover Based on Moldflow[J]. Journal of Xihua University(Natural Science Edition), 2017, 36(3): 65-68,77. DOI: 10.3969/j.issn.1673-159X.2017.03.011
Citation: WANG Min, ZHANG Yuqing, YANG Xiaoshuai, ZHANG Pu, CHEN Yang, XIE Guangqiang. Simulation Analysis and Optimization of Injection Molding of Mobile Phone Back Cover Based on Moldflow[J]. Journal of Xihua University(Natural Science Edition), 2017, 36(3): 65-68,77. DOI: 10.3969/j.issn.1673-159X.2017.03.011

Simulation Analysis and Optimization of Injection Molding of Mobile Phone Back Cover Based on Moldflow

  • CAD three-dimensional model of mobile phone back cover is obtained by Pro/E software. By using Moldflow software, "flow + cooling + warp" injection molding is simulated for the finite element model of the product. According to the best parameter combination of the quality (molding window) analysis, the injection molding process parameters were optimized and a new injection molding simulation was completed, then the different aspects of the injection products were synthetically compared, such as fill time, weld mark, average temperature, warp deformation. At last, reasonable injection molding process parameters were determined, and quality defects that may occur were improved in the process of injection molding, and the development cycle of injection molding products was effectively reduced.
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